Contacting Josephson junctions via airbridges in superconducting circuits
2026-06-11 19:09
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Superconducting circuit devices require electrical interconnects between different circuit elements
on the chip, for which conventional device architectures use a combination of two structural elements:
airbridges to connect non-adjacent elements in the base layer, and bandages to connect the electrodes
forming the Josephson junctions to the base layer. Bandages introduce unwanted parasitic material
interfaces and increase the manufacturing complexity. Here, we overcome the limitations imposed
by bandages by establishing all electrical interconnects with airbridges of varying size fabricated
in a single step. The airbridges show a high yield and mechanical stability over a wide range of
sizes from 0.5 µm to 4 µm in width and from 5 µm to 40 µm in length, and show low loss when
integrated in coplanar waveguide resonators and transmon qubits. Measured relaxation times up to
more than 250 µs in standard transmon geometries show that the process achieves high coherence
while substantially easing and accelerating device fabrication.
on the chip, for which conventional device architectures use a combination of two structural elements:
airbridges to connect non-adjacent elements in the base layer, and bandages to connect the electrodes
forming the Josephson junctions to the base layer. Bandages introduce unwanted parasitic material
interfaces and increase the manufacturing complexity. Here, we overcome the limitations imposed
by bandages by establishing all electrical interconnects with airbridges of varying size fabricated
in a single step. The airbridges show a high yield and mechanical stability over a wide range of
sizes from 0.5 µm to 4 µm in width and from 5 µm to 40 µm in length, and show low loss when
integrated in coplanar waveguide resonators and transmon qubits. Measured relaxation times up to
more than 250 µs in standard transmon geometries show that the process achieves high coherence
while substantially easing and accelerating device fabrication.
Link to the article is here.
